Underwriting Agreement


Shares
facebook sharing button Share
twitter sharing button Tweet
whatsapp sharing button Share
telegram sharing button Share
googlebookmarks sharing button Mark

On 18th April 2024, Feytech Holdings Berhad has signed an underwriting agreement with TA Securities Holdings Berhad and AmInvestment Bank Berhad for its IPO on Bursa Malaysia. This milestone event sets the stage for Feytech, a leading automotive cover and seat manufacturer to expand its operations and facilities in Malaysia, enhancing its capacity to serve major clients like Mazda, and Kia. The event, attended by key representatives from all involved parties marks a significant milestone in Feytech's strategic and financial growth. Connie Go, Executive Director and CEO of Feytech, emphasised the strategic growth opportunities enabled by this IPO, aligning with their commitment to excellence and innovation in the automotive industry.